Plans to establish compound semiconductor / silicon photonics / sensor plants and semiconductor assembly, testing, marking and packaging (ATMP) / OSAT facilities in India
Document number. W ‑ 38 / 23 / 2021 ‑ iphw Ministry of electronics and information technology, government of India (meity) date: December 30, 2021 theme: guidelines for effective operation plan compound semiconductor / silicon photonics / sensors faband semiconductor assembly, testing, marking and packaging (ATMP) / OSAT facilities in India Marking and packaging (ATMP) / OSAT's facilities in India (hereinafter referred to as the "plan") have been notified in CG ‑ DL ‑ e ‑ 21122021 ‑ 232047 dated 21 December 2021. 1.2 according to paragraph 8 of the scheme, the scheme should be open to applications for an initial period of three years, starting from 1 January 2022. The term of the plan is approved by the Minister of electronic and information technology (meit). 1.3 according to Article 13 of the above plan, in order to effectively operate and smoothly implement the plan, the following guidelines are being developed. These guidelines are read together with the plan. In case of any inconsistency and guidance between the plans, the provisions of this plan shall prevail. 1.4 the program guide includes, inter Alia, the following: a) definition b) eligibility for financial support (iphw Department) page 1 of 18 machinetranslatedbygoogle